KYOCERA

Kyocera offers a wide variety of standard ceramic packages, including ceramic dual inline packages (C-DIP), ceramic small outline packages (C-SOP), ceramic pin grid array packages (C-PGA), ceramic quad flat packages (C-QFP), ceramic quad flat J-leaded packages (C-QFJ) and ceramic quad flat non-leaded packages (C-QFN). Standard ceramic packages are useful in customer device evaluations and low volume orders, enabling customers to reduce tooling costs and design time. Please contact us for details.

 

Surface Mount Ceramic Packages for Electronic Devices

• Ceramic Packages for MEMS Sensors

Ceramic Packages and Optics for Image Sensors

• Ceramic Packages for Light Emitting Diodes (LEDs)

Components for Automotive Electronics

• Ceramic Packages for Power Electronics

Ceramic Packages for Large Scale Integration (LSI) Devices

• Components for Fiber-Optic Communication Modules

Components for Wireless Communication Devices      

• Components for Fiber-Optic Connectors